Die Brush & Foam Pad for Wafer-Thin Dies (660513)
![Sizzix Die Brush & Foam Pad for Wafer-Thin Dies (660513) Sizzix Die Brush & Foam Pad for Wafer-Thin Dies (660513)](https://cdn.webshopapp.com/shops/18175/files/430891432/98x98x1/sizzix-die-brush-foam-pad-for-wafer-thin-dies-6605.jpg)
![Sizzix Die Brush & Foam Pad for Wafer-Thin Dies (660513) Sizzix Die Brush & Foam Pad for Wafer-Thin Dies (660513)](https://cdn.webshopapp.com/shops/18175/files/430891440/98x98x1/sizzix-die-brush-foam-pad-for-wafer-thin-dies-6605.jpg)
![Sizzix Die Brush & Foam Pad for Wafer-Thin Dies (660513) Sizzix Die Brush & Foam Pad for Wafer-Thin Dies (660513)](https://cdn.webshopapp.com/shops/18175/files/430891434/98x98x1/sizzix-die-brush-foam-pad-for-wafer-thin-dies-6605.jpg)
Product description
When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.
Product specifications
- Article number
- 841182097989
- EAN
- 841182097989